2012mm,HE-MCC-21-32.768K-12.5,HEC小体积晶振,32.768KHz,美国进口晶振,HEC晶振,编码为:HE-MCC-21-32.768K-12.5,频率:32.768KHz,负载电容:12.5pF,紧密公差:±20ppm,小体积晶振尺寸:2.0x1.2mm,两脚贴片晶振,石英晶振,无源晶振,SMD晶振,石英晶体谐振器,2012晶振,无铅晶振。工作温度范围:-40℃至+85℃。具有超小型,轻薄型,高性能,高品质,耐热及耐环境等特点。应用于:智能穿戴设备晶振,通讯设备晶振,钟表电子晶振,时钟晶振,平板电脑晶振,数字显示晶振,数码电子等应用。
2012mm,HE-MCC-21-32.768K-12.5,HEC小体积晶振,32.768KHz,产品特点:
•绝缘电阻:最小500MΩ@直流100V
•温度系数:-0.034±0.006ppm/℃²
•符合ROHS
2012mm,HE-MCC-21-32.768K-12.5,HEC小体积晶振,32.768KHz,参数表
PARAMETERS
CONDITIONS
MINIMUM
STANDARD
MAXIMUM
UNIT
FREQUENCY RANGE
32.768
KHz
FREQ. TOLERANCE
at 25 °C
±20
PPM
DRIVE LEVEL
10μW typical
100μW Max.
OPERATING TEMPERATURE
-40 °C to +85 °C
°C
STORAGE TEMPERATURE
-40 °C to +85 °C
°C
SHUNT CAPACITANCE (CO)
1.5
pF
LOAD CAPACITANCE (CL)
12.5 pF
pF
ESR
70KΩMax.
AGING CHARACTERISTICS
±3 PPM / year
TEMPERATURE COEFFICIENT -0.034±0.006ppm/℃²
2012mm,HE-MCC-21-32.768K-12.5,HEC小体积晶振,32.768KHz,尺寸图